- 密度 [g/cm3]: 2.9
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 2.90 g/cc | 0.105 lb/in³ | ASTM D1475 |
| Viscosity | 25000 cP | 25000 cP | Spindle #5; 10 rpm; ASTM D1824 |
| Outgassing - Total Mass Loss | 0.10 % | 0.10 % | Cured property at 125ºC; at 10E-6 torr; ASTM E595 |
| Collected Volatile Condensable Material | 0.0010 % | 0.0010 % | Cured property at 125ºC; at 10E-6 torr; ASTM E595 |
| Mechanical Properties | Metric | English | Comments |
| Hardness, Shore D | 89 | 89 | ASTM D2240 |
| Adhesive Bond Strength | 15.2 MPa | 2200 psi | Al-to-Al Lap Shear; Cured property; ASTM D1002 |
| 39.3 MPa | 5700 psi | Cured property; Die Shear for Ag to Si, 0.07" x 0.07" IC | |
| Electrical Properties | Metric | English | Comments |
| Volume Resistivity | 0.00020 ohm-cm | 0.00020 ohm-cm | Cured property; ASTM D257 |
| Thermal Properties | Metric | English | Comments |
| CTE, linear | 45.0 µm/m-°C @Temperature 20.0 °C | 25.0 µin/in-°F @Temperature 68.0 °F | Cured property; alpha 1; Perkin Elmer TMS-2 |
| 147 µm/m-°C @Temperature 20.0 °C | 81.7 µin/in-°F @Temperature 68.0 °F | Cured property; alpha 2; Perkin Elmer TMS-2 | |
| Glass Transition Temp, Tg | 155 °C | 311 °F | Cured property; Perkin-Elmer TMS-2 |
| Flash Point | >= 150 °C | >= 302 °F | ASTM D92 |
| Processing Properties | Metric | English | Comments |
| Processing Temperature | 150 °C | 302 °F | Cure 2 hrs |
| 165 °C | 329 °F | Cure 2 hrs | |