- 密度 [g/cm3]: 3.0
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 3.00 g/cc | 0.108 lb/in³ | ASTM D1475 |
| Mechanical Properties | Metric | English | Comments |
| Adhesive Bond Strength | 2.24 MPa | 325 psi | Al-to-Al Lap Shear; Cured property; ASTM D1002 |
| Electrical Properties | Metric | English | Comments |
| Volume Resistivity | 0.0030 ohm-cm | 0.0030 ohm-cm | Cured property; ASTM D257 |
| Thermal Properties | Metric | English | Comments |
| Thermal Conductivity | >= 1.50 W/m-K | >= 10.4 BTU-in/hr-ft²-°F | COLORA |
| Glass Transition Temp, Tg | <= -50.0 °C | <= -58.0 °F | Cured property; Perkin Elmer TM-2 |
| Flash Point | >= 200 °C | >= 392 °F | ASTM D92 |
| Processing Properties | Metric | English | Comments |
| Processing Temperature | 85.0 °C | 185 °F | Cure 120 min. |
| 125 °C | 257 °F | Cure 30 min. | |
| 260 °C | 500 °F | Cure 30 sec; through solder reflow process | |