Aptek 6100-1A/B Epoxy Encapsulant

Aptek 6100-1A/B Epoxy Encapsulant 物性表: Aptek 6100-1A/B Epoxy Encapsulant物性表及特性介绍,Aptek 6100-1A/B Epoxy Encapsulant注塑参数详情,如需Aptek 6100-1A/B Epoxy Encapsulant下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.18
 
Physical PropertiesMetricEnglishComments
Density 1.18 g/cc0.0426 lb/in³A Component; ASTM D1475
 1.20 g/cc0.0434 lb/in³B Component; ASTM D1475
Viscosity 350 cP350 cPB Component; Spindle #2; speed 50 rpm; ASTM D1824
 1900 cP1900 cPA Component; Spindle #2; speed 10 rpm; ASTM D1824
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8989Cured property; ASTM D2240
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cmCured property; ASTM D257
Dielectric Constant 3.7
@Frequency 1000 Hz
3.7
@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.015
@Frequency 1000 Hz
0.015
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  <= 85.0 µm/m-°C
@Temperature 20.0 °C
<= 47.2 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; Perkin Elmer TMS-2
 <= 275 µm/m-°C
@Temperature 20.0 °C
<= 153 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg >= 125 °C>= 257 °FCured property; Perkin Elmer TMS-2
Flash Point >= 150 °C>= 302 °FB Component; ASTM D92
 >= 200 °C>= 392 °FA Component; ASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 115 °C239 °FCure 12 hrs.

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