Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound

Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound 物性表: Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound物性表及特性介绍,Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound注塑参数详情,如需Aptek 6108-PMF Epoxy Encapsulant and/or Potting Compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.2
 
Physical PropertiesMetricEnglishComments
Density 1.20 g/cc0.0434 lb/in³ASTM D1475
Viscosity 2400 cP2400 cPSpindle #2; speed 10 rpm; ASTM D1824
Outgassing - Total Mass Loss 0.10 %0.10 %Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.010 %0.010 %Cured property; at 10E-6 torr; ASTM E595
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8888Cured property; ASTM D2240
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cmCured property; ASTM D257
Dielectric Constant 3.3
@Frequency 1000 Hz
3.3
@Frequency 1000 Hz
Cured property; ASTM D150
Dissipation Factor 0.0090
@Frequency 1000 Hz
0.0090
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  72.0 µm/m-°C
@Temperature 20.0 °C
40.0 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; Perkin Elmer TMS-2
 200 µm/m-°C
@Temperature 20.0 °C
111 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg 165 °C329 °FCured property; Perkin Elmer TMS-2
Flash Point >= 200 °C>= 392 °FASTM D92
 
Descriptive Properties
ColorClear Amber

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