Aremco Aremco-Bond™ 556-HT-HC Electrically & Thermally Conductive Adhesive, Silver-Filled, Highly Co

Aremco Aremco-Bond™ 556-HT-HC Electrically & Thermally Conductive Adhesive, Silver-Filled, Highly Co 物性表: Aremco Aremco-Bond™ 556-HT-HC Electrically & Thermally Conductive Adhesive, Silver-Filled, Highly Co物性表及特性介绍,Aremco Aremco-Bond™ 556-HT-HC Electrically & Thermally Conductive Adhesive, Silver-Filled, Highly Co注塑参数详情,如需Aremco Aremco-Bond™ 556-HT-HC Electrically & Thermally Conductive Adhesive, Silver-Filled, Highly Co下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 3.10 g/cc3.10 g/ccmixed
Particle Size <= 20 µm<= 20 µm
Viscosity 40000 - 45000 cP40000 - 45000 cPmixed
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 9090
Shear Strength 11.7 MPa1700 psiASTM D1002-94
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 0.00010 ohm-cm0.00010 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 2.20 W/m-K15.3 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 199 °C390 °FContinuous
 249 °C480 °FIntermittent
 
Processing PropertiesMetricEnglishComments
Cure Time  60.0 min
@Temperature 121 °C
1.00 hour
@Temperature 250 °F
alternate cure
 120 min
@Temperature 93.3 °C
2.00 hour
@Temperature 200 °F
recommended cure
Pot Life 2880 min2880 min25 gm mass @ 25 °C
Shelf Life 6.00 Month6.00 Month
 
Descriptive Properties
ColorSilver
FillerSilver Flake
Mix Ratio by Weight100:2

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