Parker Chomerics CHO-BOND SV712 Conductive Epoxy

Parker Chomerics CHO-BOND SV712 Conductive Epoxy 物性表: Parker Chomerics CHO-BOND SV712 Conductive Epoxy物性表及特性介绍,Parker Chomerics CHO-BOND SV712 Conductive Epoxy注塑参数详情,如需Parker Chomerics CHO-BOND SV712 Conductive Epoxy下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 3.00 - 3.60 g/cc3.00 - 3.60 g/cc
Volatile Organic Compounds (VOC) Content 0.00 g/l0.00 g/l
Solubility in Water 0.00 %0.00 %Insoluble
Thickness 25.4 microns1.00 milRecommended
 
Mechanical PropertiesMetricEnglishComments
Shear Strength >= 7.58 MPa>= 1100 psiLap
 >= 33.1 MPa>= 4800 psiDie
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.00040 ohm-cm<= 0.00040 ohm-cmDC
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 150 °C302 °F
Minimum Service Temperature, Air -45.0 °C-49.0 °F
Flash Point >= 93.3 °C>= 200 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  30.0 min
@Temperature 150 °C
0.500 hour
@Temperature 302 °F
 60.0 min
@Temperature 125 °C
1.00 hour
@Temperature 257 °F
Shelf Life 12.0 Month
@Temperature -40.0 °C
12.0 Month
@Temperature -40.0 °F
 
Component Elements PropertiesMetricEnglishComments
Silver, Ag 60 - 85 %60 - 85 %
 
Descriptive Properties
Amine Compound Proprietary wt. % Max5
BinderEpoxy
ConsistencyThixotropic Paste
Epoxy Resin, wt %15 - 25
FillerAg
Mix Ratio1-part
o-Cresyl glycidyle ether wt. % Max10
Work Life4 weeks

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