Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound

Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound 物性表: Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound物性表及特性介绍,Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound注塑参数详情,如需Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.92
  • 弯曲模量 [MPa]: 17.0
 
Physical PropertiesMetricEnglishComments
Density 1.92 g/cc0.0694 lb/in³
Viscosity 7500 cP
@Temperature 175 °C
7500 cP
@Temperature 347 °F
Automatic orifice Viscosity
Spiral Flow 76.0 cm29.9 in175°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7676
Flexural Strength 132 MPa19100 psi
Flexural Modulus 17.0 GPa2470 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 3.50e+15 ohm-cm3.50e+15 ohm-cm
Dielectric Constant 3.55
@Frequency 1000 Hz
3.55
@Frequency 1000 Hz
Dielectric Strength 31.0 kV/mm787 kV/in
Dissipation Factor 0.0023
@Frequency 1000 Hz
0.0023
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 14.0 µm/m-°C
@Temperature 20.0 °C
7.78 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 63.0 µm/m-°C
@Temperature 20.0 °C
35.0 µin/in-°F
@Temperature 68.0 °F
Glass Transition Temp, Tg 147 °C297 °F
Flammability, UL94  V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 175 °C347 °FMolding temperature

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