Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound

Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound 物性表: Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound物性表及特性介绍,Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound注塑参数详情,如需Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.86
  • 弯曲强度 [MPa]: 83.0
 
Physical PropertiesMetricEnglishComments
Density 1.86 g/cc0.0672 lb/in³
Spiral Flow 38.0 cm15.0 in177°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7575
Tensile Strength, Ultimate 83.0 MPa12000 psi
Flexural Strength 124 MPa18000 psi
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.8
@Frequency 1000 Hz
3.8
@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm406 kV/in
Dissipation Factor 0.0020
@Frequency 1000 Hz
0.0020
@Frequency 1000 Hz
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 21.0 µm/m-°C
@Temperature 20.0 °C
11.7 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 90.0 µm/m-°C
@Temperature 20.0 °C
50.0 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 155 °C311 °F
Flammability, UL94  V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 170 - 190 °C338 - 374 °FMolding temperature

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