Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant

Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant 物性表: Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant物性表及特性介绍,Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant注塑参数详情,如需Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.88
  • 吸水率 [%]: 0.0034
  • 弯曲模量 [MPa]: 14.0
 
Physical PropertiesMetricEnglishComments
Density 1.88 g/cc0.0679 lb/in³
Water Absorption 0.0034 %0.0034 %
Viscosity 8500 cP
@Temperature 175 °C
8500 cP
@Temperature 347 °F
Automatic orifice Viscosity
Linear Mold Shrinkage 0.0025 cm/cm0.0025 in/in
Spiral Flow 95.0 cm37.4 in
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 6060
Flexural Strength 121 MPa17500 psi
Flexural Modulus 14.0 GPa2030 ksi
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.8
@Frequency 1000 Hz
3.8
@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm406 kV/in
Dissipation Factor 0.0020
@Frequency 1000 Hz
0.0020
@Frequency 1000 Hz
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 12.5 µm/m-°C
@Temperature 20.0 °C
6.94 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 65.0 µm/m-°C
@Temperature 20.0 °C
36.1 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 166 °C331 °F
Flammability, UL94  V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 170 - 185 °C338 - 365 °FMolding temperature

转载请注明: 转自中国塑胶原料之家 http://www.su-jiao.com/wuxingbiao/

本文链接: http://www.su-jiao.com/yuanliaoku/show-32766.html

免责声明: 本文 Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant 仅代表作者个人观点,中国塑胶原料之家无关。中国塑胶原料之家网所转载的内容,其版权均由原作者和资料提供方所拥有!如因作品版权问题需要处理,请与我们联络

塑胶原料之家,专业塑料网站、原料报价网站,免费发布塑胶供求信息。塑胶原料之家为您提供塑料供应、塑料求购、塑料行情、塑料展会、塑料原料资讯服务。

2008-2015 塑料|塑胶原料|物性表大全|UL黄卡|SGS报告查询|最新价格--塑胶原料之家

沪ICP备15027283号-4