Parker Chomerics CHO-BOND 1075 Silicone RTV Adhesive/Sealant

Parker Chomerics CHO-BOND 1075 Silicone RTV Adhesive/Sealant 物性表: Parker Chomerics CHO-BOND 1075 Silicone RTV Adhesive/Sealant物性表及特性介绍,Parker Chomerics CHO-BOND 1075 Silicone RTV Adhesive/Sealant注塑参数详情,如需Parker Chomerics CHO-BOND 1075 Silicone RTV Adhesive/Sealant下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.75 - 2.25 g/cc1.75 - 2.25 g/cc
Volatile Organic Compounds (VOC) Content 0.00 g/l0.00 g/l
Thickness >= 254 microns>= 10.0 milRecommended
 
Mechanical PropertiesMetricEnglishComments
Shear Strength >= 0.689 MPa>= 100 psiLap
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 0.010 ohm-cm0.010 ohm-cmDC
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 200 °C392 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time 10100 min168 hour@ Room Temperature
Shelf Life 6.00 Month6.00 Month
 
Descriptive Properties
BinderSilicone
ConsistencyMedium paste
Coverage17 cm2 / g
FillerAg/Al
Mix Ratio1-part
Working Life0.25 hrs

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