Momentive Performance Materials X30 Phenolic Formaldehyde Resin

Momentive Performance Materials X30 Phenolic Formaldehyde Resin 物性表: Momentive Performance Materials X30 Phenolic Formaldehyde Resin物性表及特性介绍,Momentive Performance Materials X30 Phenolic Formaldehyde Resin注塑参数详情,如需Momentive Performance Materials X30 Phenolic Formaldehyde Resin下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.4
  • 弯曲模量 [MPa]: 7.00
 
Physical PropertiesMetricEnglishComments
Density 1.40 g/cc0.0506 lb/in³ISO 1183
Apparent Bulk Density 0.460 g/cc0.0166 lb/in³ISO 60
Linear Mold Shrinkage, Flow 0.0055 cm/cm0.0055 in/inCompression molding; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 250 MPa36300 psiH 961/30; ISO 2039/P1
Tensile Strength at Break 50.0 MPa7250 psi5 mm/min; ISO 527 - 1/2
Tensile Modulus 7.50 GPa1090 ksi1 mm/min; ISO 527 - 1/2
Flexural Strength 90.0 MPa13100 psi2 mm/min; ISO 178
Flexural Modulus 7.00 GPa1020 ksiISO 178
Compressive Strength 220 MPa31900 psiTest specimen flat tested; ISO 604
Charpy Impact Unnotched 0.650 J/cm²
@Temperature 23.0 °C
3.09 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.250 J/cm²
@Temperature 23.0 °C
1.19 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+11 ohm-cm1.00e+11 ohm-cmIEC 60093
Surface Resistance 1.00e+10 ohm1.00e+10 ohmIEC 60093
Dielectric Constant 14
@Frequency 100 Hz
14
@Frequency 100 Hz
IEC 60250
Dielectric Strength 15.0 kV/mm
@Thickness 1.00 mm
381 kV/in
@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.35
@Frequency 100 Hz
0.35
@Frequency 100 Hz
IEC 60250
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 8.0 MPa 105 °C221 °FISO 75-2
Shrinkage 0.45 %0.45 %Compression molding, 168 hours/110°C; ISO 2577
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 75.0 °C140 - 167 °FInjection molding
Nozzle Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Melt Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Mold Temperature 160 - 190 °C320 - 374 °FInjection molding
 160 - 190 °C320 - 374 °FCompression molding
Injection Pressure >= 15.0 MPa>= 2180 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa72.5 - 290 psiInjection molding
Cure Time 0.167 - 0.333 min0.00278 - 0.00556 hourPer 1 mm of wall thickness, injection molding
 0.333 - 0.667 min0.00556 - 0.0111 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Chromatic SpectrumSubdued Colors
Creep Rupture StrengthGood
Holding PressureApproximately 40-60% of injection pressure
Media ResistanceGood
Moisture Absorption100 mgISO 62, 24 hours at 23°C
Reserves by Peak TemperatureHigh
Thermal ExpansionSlight

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