- 密度 [g/cm3]: 2.1
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 2.10 g/cc | 0.0759 lb/in³ | ASTM D1475 |
Viscosity | 140000 cP | 140000 cP | ASTM D1824 |
Mechanical Properties | Metric | English | Comments |
Hardness, Shore A | 83 | 83 | Cured property; ASTM D2240 |
Adhesive Bond Strength | 2.93 MPa | 425 psi | Al-to-Al Lap Shear; Cured property; ASTM D1002 |
Electrical Properties | Metric | English | Comments |
Volume Resistivity | 7.00e+14 ohm-cm | 7.00e+14 ohm-cm | Cured property; ASTM D257 |
Dielectric Constant | 5.8 @Frequency 1000 Hz | 5.8 @Frequency 1000 Hz | Cured property; ASTM D150 |
Dielectric Strength | 24.4 kV/mm @Thickness 1.27 mm | 620 kV/in @Thickness 0.0500 in | Cured; ASTM D149 |
Dissipation Factor | 0.030 @Frequency 1000 Hz | 0.030 @Frequency 1000 Hz | Cured property; ASTM D150 |
Thermal Properties | Metric | English | Comments |
CTE, linear | 31.0 µm/m-°C @Temperature 20.0 °C | 17.2 µin/in-°F @Temperature 68.0 °F | Cured property; alpha 1 |
147 µm/m-°C @Temperature 20.0 °C | 81.7 µin/in-°F @Temperature 68.0 °F | Cured property; alpha 2 | |
Thermal Conductivity | 1.38 W/m-K | 9.60 BTU-in/hr-ft²-°F | Cured property; COLORA |
Glass Transition Temp, Tg | -60.0 °C | -76.0 °F | Cured property; JMTP P-200 |
Flash Point | >= 200 °C | >= 392 °F | ASTM D92 |
Processing Properties | Metric | English | Comments |
Processing Temperature | 85.0 °C | 185 °F | Cure 6 hrs |
100 °C | 212 °F | Cure 4 hrs | |
125 °C | 257 °F | Cure 2 hrs |