Aptek 2100-A7C/B Low modulus urethane staking compound

Aptek 2100-A7C/B Low modulus urethane staking compound 物性表: Aptek 2100-A7C/B Low modulus urethane staking compound物性表及特性介绍,Aptek 2100-A7C/B Low modulus urethane staking compound注塑参数详情,如需Aptek 2100-A7C/B Low modulus urethane staking compound下载, 可到相关下载区下载
  • 密度 [g/cm3]: 0.99
  • 弯曲强度 [MPa]: 2.76
 
Physical PropertiesMetricEnglishComments
Density 0.990 g/cc0.0358 lb/in³A Component; ASTM D1475
 1.21 g/cc0.0437 lb/in³B Component; ASTM D1475
Viscosity 35 cP35 cPB Component; ASTM D1824
Outgassing - Total Mass Loss 0.38 %0.38 %Cured property; at 10E-6 torr; ASTM E-595
Collected Volatile Condensable Material 0.030 %0.030 %Cured property; at 10E-6 torr; ASTM E595
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 5555Cured property; ASTM D2240
Tensile Strength, Ultimate 2.76 MPa400 psiCured property; ASTM D412
Elongation at Break 265 %265 %Cured property; ASTM D412
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 5.30e+15 ohm-cm5.30e+15 ohm-cmCured property; ASTM D257
Dielectric Constant 3.5
@Frequency 1000 Hz
3.5
@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength >= 14.2 kV/mm>= 360 kV/inCured property; 0.1 inch; ASTM D149
Dissipation Factor 0.030
@Frequency 1000 Hz
0.030
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  79.0 µm/m-°C
@Temperature 20.0 °C
43.9 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; JMTP P200
 185 µm/m-°C
@Temperature 20.0 °C
103 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; JMTP P200
Glass Transition Temp, Tg -70.0 °C-94.0 °FCured property; JMTP 200
Flash Point >= 150 °C>= 302 °FA Component; ASTM D92
 >= 150 °C>= 302 °FB Component; ASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 80.0 °C176 °FCure 5 hrs + 2 hrs at RT
 100 °C212 °FCure 3 hrs + 2 hrs at RT

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