Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate

Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate 物性表: Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate物性表及特性介绍,Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate注塑参数详情,如需Rogers Corporation RT/duroid® 5880 Glass Microfiber Reinforced PTFE High Frequency Laminate下载, 可到相关下载区下载
  • 密度 [g/cm3]: 2.2
  • 弯曲强度 [MPa]: 18.0
 
Physical PropertiesMetricEnglishComments
Density 2.20 g/cc0.0795 lb/in³ASTM D792
Moisture Absorption at Equilibrium 0.020 %
@Thickness 1.57 mm
0.020 %
@Thickness 0.0620 in
D48/50; ASTM D570
Thickness 127 - 3180 microns5.00 - 125 milRange of Thicknesses Available
Deformation 1.0 %
@Pressure 14.0 MPa,
Temperature 150 °C
1.0 %
@Pressure 2030 psi,
Temperature 302 °F
Z direction; 24 hrs; ASTM D621
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate  18.0 MPa
@Temperature 100 °C
2610 psi
@Temperature 212 °F
Y direction, Condition A; ASTM D638
 20.0 MPa
@Temperature 100 °C
2900 psi
@Temperature 212 °F
X direction, Condition A; ASTM D638
 27.0 MPa
@Temperature 23.0 °C
3920 psi
@Temperature 73.4 °F
Y direction, Condition A; ASTM D638
 29.0 MPa
@Temperature 23.0 °C
4210 psi
@Temperature 73.4 °F
X direction, Condition A; ASTM D638
Elongation at Break  4.9 %
@Temperature 23.0 °C
4.9 %
@Temperature 73.4 °F
Y direction, Condition A; ASTM D638
 5.8 %
@Temperature 100 °C
5.8 %
@Temperature 212 °F
Y direction, Condition A; ASTM D638
 6.0 %
@Temperature 23.0 °C
6.0 %
@Temperature 73.4 °F
X direction, Condition A; ASTM D638
 7.2 %
@Temperature 100 °C
7.2 %
@Temperature 212 °F
X direction, Condition A; ASTM D638
Tensile Modulus  0.379 GPa
@Temperature 100 °C
55.0 ksi
@Temperature 212 °F
Y direction; ASTM D638
 0.448 GPa
@Temperature 100 °C
65.0 ksi
@Temperature 212 °F
X direction; ASTM D638
 0.862 GPa
@Temperature 23.0 °C
125 ksi
@Temperature 73.4 °F
Y direction; ASTM D638
 1.08 GPa
@Temperature 23.0 °C
156 ksi
@Temperature 73.4 °F
X direction; ASTM D638
Compressive Strength  21.0 MPa
@Strain 7.80 %,
Temperature 100 °C
3050 psi
@Strain 7.80 %,
Temperature 212 °F
Y direction, Condition A; ASTM D695
 22.0 MPa
@Strain 8.40 %,
Temperature 100 °C
3190 psi
@Strain 8.40 %,
Temperature 212 °F
X direction, Condition A; ASTM D695
 27.0 MPa
@Strain 8.50 %,
Temperature 23.0 °C
3920 psi
@Strain 8.50 %,
Temperature 73.4 °F
X direction, Condition A; ASTM D695
 29.0 MPa
@Strain 7.70 %,
Temperature 23.0 °C
4210 psi
@Strain 7.70 %,
Temperature 73.4 °F
Y direction, Condition A; ASTM D695
 43.0 MPa
@Strain 17.6 %,
Temperature 100 °C
6240 psi
@Strain 17.6 %,
Temperature 212 °F
Z direction, Condition A; ASTM D695
 52.0 MPa
@Strain 12.5 %,
Temperature 23.0 °C
7540 psi
@Strain 12.5 %,
Temperature 73.4 °F
Z direction, Condition A; ASTM D695
Compressive Modulus  0.500 GPa
@Temperature 100 °C
72.5 ksi
@Temperature 212 °F
X direction, Condition A; ASTM D695
 0.500 GPa
@Temperature 100 °C
72.5 ksi
@Temperature 212 °F
Y direction, Condition A; ASTM D695
 0.670 GPa
@Temperature 100 °C
97.2 ksi
@Temperature 212 °F
Z direction, Condition A; ASTM D695
 0.710 GPa
@Temperature 23.0 °C
103 ksi
@Temperature 73.4 °F
X direction, Condition A; ASTM D695
 0.710 GPa
@Temperature 23.0 °C
103 ksi
@Temperature 73.4 °F
Y direction, Condition A; ASTM D695
 0.940 GPa
@Temperature 23.0 °C
136 ksi
@Temperature 73.4 °F
Z direction, Condition A; ASTM D695
Peel Strength 5.47 kN/m31.2 pli1 oz EDC foil; after solder float; IPC-TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.00e+13 ohm-cm2.00e+13 ohm-cmZ direction; C96/35/90; ASTM D257
Surface Resistance 3.00e+13 ohm3.00e+13 ohmZ direction; C96/35/90; ASTM D257
Dielectric Constant  2.2
@Frequency 8.00e+9 - 4.00e+10 Hz
2.2
@Frequency 8.00e+9 - 4.00e+10 Hz
Design; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
 2.18 - 2.24
@Frequency 1.00e+10 Hz
2.18 - 2.24
@Frequency 1.00e+10 Hz
Process; Z direction; C24/23/50; IPC-TM-650 2.5.5.5
Dissipation Factor  0.00040
@Frequency 1.00e+6 Hz
0.00040
@Frequency 1.00e+6 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.3
 0.00090
@Frequency 1.00e+10 Hz
0.00090
@Frequency 1.00e+10 Hz
Z direction; C24/23/50; IPC-TM-650 2.5.5.5
 
Thermal PropertiesMetricEnglishComments
CTE, linear  31.0 µm/m-°C
@Temperature 0.000 - 100 °C
17.2 µin/in-°F
@Temperature 32.0 - 212 °F
X-Direction; IPC-TM-650 2.4.41
 48.0 µm/m-°C
@Temperature 0.000 - 100 °C
26.7 µin/in-°F
@Temperature 32.0 - 212 °F
Y-Direction; IPC-TM-650 2.4.41
 237 µm/m-°C
@Temperature 0.000 - 100 °C
132 µin/in-°F
@Temperature 32.0 - 212 °F
Z-Direction; IPC-TM-650 2.4.41
Specific Heat Capacity 0.960 J/g-°C0.229 BTU/lb-°Fcalculated
Thermal Conductivity 0.200 W/m-K
@Temperature 80.0 °C
1.39 BTU-in/hr-ft²-°F
@Temperature 176 °F
Z direction; ASTM C518
Deflection Temperature at 1.8 MPa (264 psi) >= 260 °C>= 500 °FX, Y direction; ASTM D648
Decomposition Temperature 500 °C932 °FTGA; ASTM D3850
Flammability, UL94 V-0V-0
 
Descriptive Properties
Thermal Coefficient of Dielectric Constant-125 ppm/°CIPC-TM-650 2.5.5.5; -50°C to 150°C

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