特种 Xydar® MG-850 LCP，50%玻璃\矿物

MG-850 LCP 类别：聚合物；热塑性；液晶聚合物（LCP）
MG-850 LCP 材料说明：®mg-850 XYDAR液晶聚合物（LCP）是一个50%的玻璃/矿物增强注塑级用于电气/电子应用表面贴装技术的应用。材料可以填充非常薄的墙壁，长时间的流动。此外，低翘曲，它具有高的强度和刚度（即使在高温下），热膨胀系数低，热变形温度高，固有的阻燃性和良好的化学和抗风化。
MG-850 LCP 特点：阻燃剂；耐化学性好；成型性好；耐候性好；高刚度；高强度；低翘曲 
MG-850 LCP 附加属性：灰分含量ASTM d5630 50%；断裂伸长率- ASTM D790 1.40%弯曲应变；成型收缩率- ASTM d955 0.41%；成型收缩率- ASTM d955 0.058%；缺口冲击- ASTM D256 5.50 kJ/m²；无缺口冲击- ASTM D256 25.2 kJ/m²；水ASTM d570 4.0e-3 %吸收 
MG-850 LCP 的物性表：

Physical Properties	Metric	English	Comments
Density	1.86 g/cc	0.0672 lb/in³	ASTM D792
Filler Content	50 %	50 %	Glass\Mineral
Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	122 MPa	17700 psi	ASTM D638
Elongation at Break	1.2 %	1.2 %	ISO 527-2
Tensile Modulus	17.9 GPa	2600 ksi	ASTM D638
Flexural Strength	168 MPa	24400 psi	ASTM D790
Flexural Modulus	15.2 GPa	2200 ksi	ASTM D790
Charpy Impact Unnotched	2.10 J/cm²	9.99 ft-lb/in²	Complete Break; ISO 179
Charpy Impact, Notched	0.680 J/cm²	3.24 ft-lb/in²	Complete Break; ISO 179
Thermal Properties	Metric	English	Comments
CTE, linear, Parallel to Flow	58.0 µm/m-°C	32.2 µin/in-°F
CTE, linear, Transverse to Flow	66.0 µm/m-°C @Temperature 0.000 - 200 °C	36.7 µin/in-°F @Temperature 32.0 - 392 °F	TMA; ASTM E831
Deflection Temperature at 0.46 MPa (66 psi)	287 °C	549 °F	HDT B; Unannealed; ISO 75-2/B
Deflection Temperature at 1.8 MPa (264 psi)	248 °C	478 °F	Unannealed; ISO 75-2/A
Flammability, UL94	V-0 @Thickness 0.200 mm	V-0 @Thickness 0.00787 in
Processing Properties	Metric	English	Comments
Melt Temperature	330 - 360 °C	626 - 680 °F
Mold Temperature	70.0 - 160 °C	158 - 320 °F
Drying Temperature	150 °C @Time 21600 - 28800 sec	302 °F @Time 6.00 - 8.00 hour