Sumitomo Bakelite North America E 16521A Electrical Encapsulation Grade Epoxy

Sumitomo Bakelite North America E 16521A Electrical Encapsulation Grade Epoxy 物性表: Sumitomo Bakelite North America E 16521A Electrical Encapsulation Grade Epoxy物性表及特性介绍,Sumitomo Bakelite North America E 16521A Electrical Encapsulation Grade Epoxy注塑参数详情,如需Sumitomo Bakelite North America E 16521A Electrical Encapsulation Grade Epoxy下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.6
  • 吸水率 [%]: 0.25
  • 缺口冲击强度: 0.19
  • 弯曲模量 [MPa]: 7.00
 
Physical PropertiesMetricEnglishComments
Bulk Density 0.800 g/cc0.0289 lb/in³ASTM D1895
Density 1.60 g/cc0.0578 lb/in³ASTM D792
Water Absorption 0.25 %
@Temperature 50.0 °C,
Time 173000 sec
0.25 %
@Temperature 122 °F,
Time 48.0 hour
ASTM D570
Linear Mold Shrinkage 0.0050 - 0.0070 cm/cm0.0050 - 0.0070 in/inASTM D955
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 62.0 MPa8990 psiASTM D638
Flexural Strength 104 MPa15100 psiat rupture; ASTM D790
Flexural Modulus 7.00 GPa1020 ksiASTM D790
Compressive Strength 172 MPa24900 psiASTM D695
Izod Impact, Notched 0.190 J/cm0.356 ft-lb/inASTM D256
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 4.4
@Frequency 1.00e+6 Hz
4.4
@Frequency 1.00e+6 Hz
wet; ASTM D150
Dielectric Strength  14.0 kV/mm
@Frequency 60.0 Hz
356 kV/in
@Frequency 60.0 Hz
step-by-step, dry; ASTM D149
 17.0 kV/mm
@Frequency 60.0 Hz
432 kV/in
@Frequency 60.0 Hz
short time, dry; ASTM D149
Dissipation Factor 0.015
@Frequency 1.00e+6 Hz
0.015
@Frequency 1.00e+6 Hz
wet; ASTM D150
Arc Resistance 120 sec120 secASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 40.0 µm/m-°C22.2 µin/in-°FASTM E831
Deflection Temperature at 1.8 MPa (264 psi) 122 °C252 °FPost Baked; ASTM D648A
 
Descriptive Properties
ColorBlack
FormGranular
Molding MethodCompression
 Transfer

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