Cookson Group Plaskon® 150.401 Encapsulation Resin

Cookson Group Plaskon® 150.401 Encapsulation Resin 物性表: Cookson Group Plaskon® 150.401 Encapsulation Resin物性表及特性介绍,Cookson Group Plaskon® 150.401 Encapsulation Resin注塑参数详情,如需Cookson Group Plaskon® 150.401 Encapsulation Resin下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.9
  • 弯曲模量 [MPa]: 18.0
 
Physical PropertiesMetricEnglishComments
Density 1.90 g/cc0.0686 lb/in³
Viscosity 8200 cP
@Temperature 175 °C
8200 cP
@Temperature 347 °F
Shimadzu Viscosity, 1000 psi
Spiral Flow 74.0 cm29.1 in175°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8888
Flexural Strength 76.0 MPa11000 psi
Flexural Modulus 18.0 GPa2610 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 4.70e+16 ohm-cm4.70e+16 ohm-cm
Dielectric Constant 3.6
@Frequency 1000 Hz
3.6
@Frequency 1000 Hz
Dissipation Factor 0.0020
@Frequency 1000 Hz
0.0020
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 15.5 µm/m-°C
@Temperature 20.0 °C
8.61 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 55.5 µm/m-°C
@Temperature 20.0 °C
30.8 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 220 °C428 °F
Flammability, UL94  V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 170 - 185 °C338 - 365 °FMolding temperature

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