- 密度 [g/cm3]: 1.73
- 吸水率 [%]: 0.06
- 弯曲强度 [MPa]: 105.0
- 弯曲模量 [MPa]: 16.0
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Bulk Density | 0.800 g/cc | 0.0289 lb/in³ | Powder; ISO 60 | ||
| Density | 1.73 g/cc | 0.0625 lb/in³ | ISO 1183 | ||
| Water Absorption | 0.060 % | 0.060 % | ISO 62 | ||
| Linear Mold Shrinkage | 0.00050 cm/cm | 0.00050 in/in | ISO 2577 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Hardness, Rockwell M | 95 | 95 | ISO 2039/2 | ||
| Tensile Strength, Ultimate | 105 MPa | 15200 psi | ISO 527 | ||
| Flexural Strength | 215 MPa | 31200 psi | ISO 178 | ||
| Flexural Modulus | 16.0 GPa | 2320 ksi | ISO 178 | ||
| Compressive Strength | 380 MPa | 55100 psi | ISO 604 | ||
| Charpy Impact, Notched | 0.350 J/cm² | 1.67 ft-lb/in² | ISO 179 | ||
| Electrical Properties | Metric | English | Comments | ||
| Dielectric Strength | 13.5 kV/mm @Thickness 3.00 mm | 343 kV/in @Thickness 0.118 in | IEC 243 | ||
| Arc Resistance | 145 sec | 145 sec | ASTM D495 | ||
| Comparative Tracking Index | 175 V | 175 V | IEC 112 | ||
| Thermal Properties | Metric | English | Comments | ||
| CTE, linear, Parallel to Flow | 16.0 µm/m-°C @Temperature 23.0 °C | 8.89 µin/in-°F @Temperature 73.4 °F | TMA | ||
| Thermal Conductivity | 0.580 W/m-K | 4.03 BTU-in/hr-ft²-°F | ASTM F433 | ||
| Deflection Temperature at 1.8 MPa (264 psi) | 215 °C | 419 °F | As Molded; ISO 75 A | ||
| >= 282 °C | >= 540 °F | Post Baked; ISO 75 A | |||
| Descriptive Properties | |||||
| Available Molding Grades | Compression, Transfer, Injection | ||||
| Color | Black, Green | ||||
| Form | Granular | ||||