- 密度 [g/cm3]: 1.85
- 弯曲模量 [MPa]: 25.0
| Physical Properties | Metric | English | Comments | ||
|---|---|---|---|---|---|
| Density | 1.85 g/cc | 0.0668 lb/in³ | ISO 1183 | ||
| Apparent Bulk Density | 0.650 g/cc | 0.0235 lb/in³ | ISO 60 | ||
| Linear Mold Shrinkage, Flow | -0.000100 cm/cm | -0.000100 in/in | Compression molding; ISO 2577 | ||
| Mechanical Properties | Metric | English | Comments | ||
| Ball Indentation Hardness | 425 MPa | 61600 psi | H 961/30; ISO 2039/P1 | ||
| Flexural Strength | 85.0 MPa | 12300 psi | 2 mm/min; ISO 178 | ||
| Flexural Modulus | 25.0 GPa | 3630 ksi | ISO 178 | ||
| Compressive Strength | 135 MPa | 19600 psi | Test specimen flat tested; ISO 604 | ||
| Charpy Impact Unnotched | 0.300 J/cm² @Temperature 23.0 °C | 1.43 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eU | ||
| Charpy Impact, Notched | 0.200 J/cm² @Temperature 23.0 °C | 0.952 ft-lb/in² @Temperature 73.4 °F | ISO 179-1/2 eA | ||
| Electrical Properties | Metric | English | Comments | ||
| Volume Resistivity | 1.00e+12 ohm-cm | 1.00e+12 ohm-cm | IEC 60093 | ||
| Surface Resistance | 1.00e+11 ohm | 1.00e+11 ohm | IEC 60093 | ||
| Dielectric Constant | 5.0 @Frequency 100 Hz | 5.0 @Frequency 100 Hz | IEC 60250 | ||
| Dielectric Strength | 30.0 kV/mm @Thickness 1.00 mm | 762 kV/in @Thickness 0.0394 in | IEC 60243-P1 | ||
| Dissipation Factor | 0.040 @Frequency 100 Hz | 0.040 @Frequency 100 Hz | IEC 60250 | ||
| Arc Resistance | 180 - 240 sec @Thickness 3.00 mm | 180 - 240 sec @Thickness 0.118 in | (NC) | ||
| High Voltage Arc Resistance to Ignition (HVAR) | >= 300 sec @Thickness 0.750 mm | >= 300 sec @Thickness 0.0295 in | NC | ||
| Comparative Tracking Index | 175 V | 175 V | Test liquid A; IEC 60112 | ||
| Hot Wire Ignition, HWI | 30 - 60 sec @Thickness 0.750 mm | 30 - 60 sec @Thickness 0.0295 in | NC | ||
| >= 120 sec @Thickness 1.50 mm | >= 120 sec @Thickness 0.0591 in | NC | |||
| High Amp Arc Ignition, HAI | 30 - 60 arcs @Thickness 0.750 mm | 30 - 60 arcs @Thickness 0.0295 in | NC | ||
| High Voltage Arc-Tracking Rate, HVTR | 0.000 - 10.0 mm/min @Thickness 3.00 mm | 0.000 - 0.394 in/min @Thickness 0.118 in | (NC) | ||
| Thermal Properties | Metric | English | Comments | ||
| Maximum Service Temperature, Air | 150 °C | 302 °F | <20000 hours; IEC 60216-P1 | ||
| 200 °C | 392 °F | < 50 hours; IEC 60216-P1 | |||
| Deflection Temperature at 8.0 MPa | 160 °C | 320 °F | ISO 75-2 | ||
| UL RTI, Electrical | 150 °C @Thickness 0.750 mm | 302 °F @Thickness 0.0295 in | NC | ||
| UL RTI, Mechanical with Impact | 150 °C @Thickness 0.750 mm | 302 °F @Thickness 0.0295 in | NC | ||
| UL RTI, Mechanical without Impact | 150 °C @Thickness 0.750 mm | 302 °F @Thickness 0.0295 in | NC | ||
| Flammability, UL94 | V-1 @Thickness 0.750 mm | V-1 @Thickness 0.0295 in | NC | ||
| V-0 @Thickness 3.00 mm | V-0 @Thickness 0.118 in | (NC) | |||
| Shrinkage | 0.020 % | 0.020 % | Compression molding, 168 hours/110°C; ISO 2577 | ||
| Processing Properties | Metric | English | Comments | ||
| Feed Temperature | 60.0 - 75.0 °C | 140 - 167 °F | Injection molding | ||
| Nozzle Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
| Melt Temperature | 80.0 - 100 °C | 176 - 212 °F | Injection molding | ||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding | ||
| 160 - 190 °C | 320 - 374 °F | Compression molding | |||
| Injection Pressure | >= 15.0 MPa | >= 2180 psi | Compression and injection cavity mold pressure | ||
| Back Pressure | 0.500 - 2.00 MPa | 72.5 - 290 psi | Injection molding | ||
| Cure Time | 0.167 - 0.333 min | 0.00278 - 0.00556 hour | Per 1 mm of wall thickness, injection molding | ||
| 0.333 - 0.667 min | 0.00556 - 0.0111 hour | Per 1 mm of wall thickness, compression molding | |||
| Descriptive Properties | |||||
| Chromatic Spectrum | All Colors | ||||
| Creep Rupture Strength | Very Good | ||||
| Holding Pressure | Approximately 40-60% of injection pressure | ||||
| Media Resistance | Very Good | ||||
| Moisture Absorption | 10 mg | ISO 62, 24 hours at 23°C | |||
| Reserves by Peak Temperature | Very High | ||||
| Thermal Expansion | Very Slight | ||||