Momentive Performance Materials PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shri

Momentive Performance Materials PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shri 物性表: Momentive Performance Materials PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shri物性表及特性介绍,Momentive Performance Materials PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shri注塑参数详情,如需Momentive Performance Materials PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shri下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.5
  • 弯曲模量 [MPa]: 8.00
 
Physical PropertiesMetricEnglishComments
Density 1.50 g/cc0.0542 lb/in³ISO 1183
Apparent Bulk Density 0.650 g/cc0.0235 lb/in³ISO 60
Linear Mold Shrinkage, Flow 0.0080 cm/cm0.0080 in/inInjection molding; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Flexural Strength 80.0 MPa11600 psi2 mm/min; ISO 178
Flexural Modulus 8.00 GPa1160 ksiISO 178
Charpy Impact Unnotched 0.600 J/cm²
@Temperature 23.0 °C
2.86 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.140 J/cm²
@Temperature 23.0 °C
0.666 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+12 ohm-cm1.00e+12 ohm-cmIEC 60093
Surface Resistance 1.00e+11 ohm1.00e+11 ohmIEC 60093
Dielectric Constant 10
@Frequency 100 Hz
10
@Frequency 100 Hz
IEC 60250
Dielectric Strength 25.0 kV/mm
@Thickness 1.00 mm
635 kV/in
@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.30
@Frequency 100 Hz
0.30
@Frequency 100 Hz
IEC 60250
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 8.0 MPa 110 °C230 °FISO 75-2
Shrinkage 0.40 %0.40 %Injection molding, 168 hours/110°C; ISO 2577
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 75.0 °C140 - 167 °FInjection molding
Nozzle Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Melt Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Mold Temperature 160 - 190 °C320 - 374 °FInjection molding
 160 - 190 °C320 - 374 °FCompression molding
Injection Pressure >= 15.0 MPa>= 2180 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa72.5 - 290 psiInjection molding
Cure Time 0.167 - 0.333 min0.00278 - 0.00556 hourPer 1 mm of wall thickness, injection molding
 0.333 - 0.667 min0.00556 - 0.0111 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Chromatic SpectrumAll Colors
Creep Rupture StrengthVery Good
Holding PressureApproximately 40-60% of injection pressure
Media ResistanceVery Good
Moisture Absorption55 mgISO 62, 24 hours at 23°C
Reserves by Peak TemperatureVery High
Thermal ExpansionVery Slight

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