Momentive Performance Materials X65 Phenolic Formaldehyde Resin, UL Listed

Momentive Performance Materials X65 Phenolic Formaldehyde Resin, UL Listed 物性表: Momentive Performance Materials X65 Phenolic Formaldehyde Resin, UL Listed物性表及特性介绍,Momentive Performance Materials X65 Phenolic Formaldehyde Resin, UL Listed注塑参数详情,如需Momentive Performance Materials X65 Phenolic Formaldehyde Resin, UL Listed下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.51
  • 弯曲模量 [MPa]: 8.00
 
Physical PropertiesMetricEnglishComments
Density 1.51 g/cc0.0546 lb/in³ISO 1183
Apparent Bulk Density 0.680 g/cc0.0246 lb/in³ISO 60
Linear Mold Shrinkage, Flow 0.0055 cm/cm0.0055 in/inCompression molding; ISO 2577
 0.0075 cm/cm0.0075 in/inInjection molding; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 275 MPa39900 psiH 961/30; ISO 2039/P1
Tensile Strength at Break 45.0 MPa6530 psi5 mm/min; ISO 527 - 1/2
Tensile Modulus 8.00 GPa1160 ksi1 mm/min; ISO 527 - 1/2
Flexural Strength 80.0 MPa11600 psi2 mm/min; ISO 178
Flexural Modulus 8.00 GPa1160 ksiISO 178
Compressive Strength 165 MPa23900 psiTest specimen flat tested; ISO 604
Charpy Impact Unnotched 0.650 J/cm²
@Temperature 23.0 °C
3.09 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eU
Charpy Impact, Notched 0.140 J/cm²
@Temperature 23.0 °C
0.666 ft-lb/in²
@Temperature 73.4 °F
ISO 179-1/2 eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+11 ohm-cm1.00e+11 ohm-cmIEC 60093
Surface Resistance 1.00e+10 ohm1.00e+10 ohmIEC 60093
Dielectric Constant 13
@Frequency 100 Hz
13
@Frequency 100 Hz
IEC 60250
Dielectric Strength 15.0 kV/mm
@Thickness 1.00 mm
381 kV/in
@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.30
@Frequency 100 Hz
0.30
@Frequency 100 Hz
IEC 60250
Arc Resistance 120 - 180 sec
@Thickness 3.00 mm
120 - 180 sec
@Thickness 0.118 in
BN, BK
Comparative Tracking Index 175 - 250 V
@Thickness 3.00 mm
175 - 250 V
@Thickness 0.118 in
BN, BK
Hot Wire Ignition, HWI  60 - 120 sec
@Thickness 1.50 mm
60 - 120 sec
@Thickness 0.0591 in
BN, BK
 >= 120 sec
@Thickness 3.00 mm
>= 120 sec
@Thickness 0.118 in
BN, BK
High Amp Arc Ignition, HAI 30 - 60 arcs
@Thickness 1.50 mm
30 - 60 arcs
@Thickness 0.0591 in
BN, BK
High Voltage Arc-Tracking Rate, HVTR 10.0 - 25.4 mm/min
@Thickness 3.00 mm
0.394 - 1.00 in/min
@Thickness 0.118 in
BN, BK
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 8.0 MPa 115 °C239 °FISO 75-2
UL RTI, Electrical 150 °C
@Thickness 1.50 mm
302 °F
@Thickness 0.0591 in
BN, BK
UL RTI, Mechanical with Impact 150 °C
@Thickness 1.50 mm
302 °F
@Thickness 0.0591 in
BN, BK
UL RTI, Mechanical without Impact 150 °C
@Thickness 1.50 mm
302 °F
@Thickness 0.0591 in
BN, BK
Flammability, UL94  HB
@Thickness 1.50 mm
HB
@Thickness 0.0591 in
BN, BK
 V-0
@Thickness 3.00 mm
V-0
@Thickness 0.118 in
BN, BK
Shrinkage 0.35 %0.35 %Injection molding, 168 hours/110°C; ISO 2577
 0.55 %0.55 %Compression molding, 168 hours/110°C; ISO 2577
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 75.0 °C140 - 167 °FInjection molding
Nozzle Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Melt Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Mold Temperature 160 - 190 °C320 - 374 °FCompression molding
 160 - 190 °C320 - 374 °FInjection molding
Injection Pressure >= 15.0 MPa>= 2180 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa72.5 - 290 psiInjection molding
Cure Time 0.167 - 0.333 min0.00278 - 0.00556 hourPer 1 mm of wall thickness, injection molding
 0.333 - 0.667 min0.00556 - 0.0111 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Chromatic SpectrumAll Colors
Creep Rupture StrengthVery Good
Holding PressureApproximately 40-60% of injection pressure
Media ResistanceVery Good
Moisture Absorption50 mgISO 62, 24 hours at 23°C
Reserves by Peak TemperatureVery High
Thermal ExpansionVery Slight

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