Plenco 2000 Phenolic, Granular, Compression Molded

Plenco 2000 Phenolic, Granular, Compression Molded 物性表: Plenco 2000 Phenolic, Granular, Compression Molded物性表及特性介绍,Plenco 2000 Phenolic, Granular, Compression Molded注塑参数详情,如需Plenco 2000 Phenolic, Granular, Compression Molded下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.39
  • 吸水率 [%]: 0.4
  • 缺口冲击强度: 0.174
  • 弯曲强度 [MPa]: 51.0
  • 弯曲模量 [MPa]: 8.10
 
Physical PropertiesMetricEnglishComments
Bulk Density 0.630 g/cc0.0228 lb/in³ASTM D1895
Density 1.39 g/cc0.0502 lb/in³ASTM D792
Water Absorption 0.40 %0.40 %ASTM D570
Linear Mold Shrinkage 0.0044 cm/cm0.0044 in/inASTM D955
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell E 9090ASTM D785
Tensile Strength, Ultimate 51.0 MPa7400 psiASTM D638
Elongation at Break 0.65 %0.65 %ASTM D638
Tensile Modulus 8.60 GPa1250 ksiASTM D638
Flexural Strength 92.0 MPa13300 psiASTM D790
Flexural Modulus 8.10 GPa1170 ksiASTM D790
Compressive Strength 212 MPa30700 psiASTM D695
Izod Impact, Notched 0.174 J/cm0.326 ft-lb/inASTM D256
Charpy Impact, Notched 0.187 J/cm²0.890 ft-lb/in²ASTM D256
Impact 109109J/m drop Ball Impact; PLENCO
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 3.20e+11 ohm-cm3.20e+11 ohm-cmASTM D247
Dielectric Constant 5.25.2ASTM D150
Dielectric Strength 12.2 kV/mm310 kV/inShort Time; ASTM D149
Dissipation Factor 0.0520.052ASTM D150
Arc Resistance 132 sec132 secASTM D495
Comparative Tracking Index 175 V175 VASTM D3638
 
Thermal PropertiesMetricEnglishComments
CTE, linear 59.0 µm/m-°C
@Temperature 40.0 - 130 °C
32.8 µin/in-°F
@Temperature 104 - 266 °F
TMA; ASTM E831
Thermal Conductivity 0.390 W/m-K
@Temperature 100 °C
2.71 BTU-in/hr-ft²-°F
@Temperature 212 °F
ASTM E1461
Maximum Service Temperature, Air 207 °C405 °FHeat Resistance; ASTM D570D
Deflection Temperature at 1.8 MPa (264 psi) 176 °C349 °FASTM D648
Flammability, UL94 V-1
@Thickness 1.50 mm
V-1
@Thickness 0.0591 in
Oxygen Index 27.9 %27.9 %ASTM D2863
Shrinkage 0.203 %0.203 %72 hr, 120ºC; ASTM D1299

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