Resinoid 7051 Phenolic Molding, Glass Reinforced

Resinoid 7051 Phenolic Molding, Glass Reinforced 物性表: Resinoid 7051 Phenolic Molding, Glass Reinforced物性表及特性介绍,Resinoid 7051 Phenolic Molding, Glass Reinforced注塑参数详情,如需Resinoid 7051 Phenolic Molding, Glass Reinforced下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.75
  • 吸水率 [%]: 0.1
  • 缺口冲击强度: 0.473
  • 弯曲强度 [MPa]: 65.0
  • 弯曲模量 [MPa]: 17.0
 
Physical PropertiesMetricEnglishComments
Density 1.75 g/cc0.0632 lb/in³ASTM D792A
Water Absorption 0.10 %0.10 %24 hours R.T. ASTM D570
Linear Mold Shrinkage 0.0015 cm/cm0.0015 in/inPositive Mold; ASTM D955
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell E 100100ASTM D785
Hardness, Rockwell M 120120ASTM D785
Tensile Strength, Ultimate 65.0 MPa9430 psiASTM D651
Flexural Strength 165 MPa23900 psiASTM D790
Flexural Modulus 17.0 GPa2470 ksiASTM D790
Compressive Strength 276 MPa40000 psiASTM D695
Izod Impact, Notched 0.473 J/cm0.886 ft-lb/inASTM D256A
 
Electrical PropertiesMetricEnglishComments
Dielectric Strength 14.6 kV/mm371 kV/inShort Time; Dry; ASTM D149
Arc Resistance 180 sec180 secASTM D495
Comparative Tracking Index 175 - 250 V
@Thickness 3.05 mm
175 - 250 V
@Thickness 0.120 in
UL PLC 3 (175-250 V)
Hot Wire Ignition, HWI >= 0.00 sec
@Thickness 3.05 mm
>= 0.00 sec
@Thickness 0.120 in
UL PLC 0
High Amp Arc Ignition, HAI 15 - 29 arcs
@Thickness 3.05 mm
15 - 29 arcs
@Thickness 0.120 in
UL PLC 3, 15-29 arcs
High Voltage Arc-Tracking Rate, HVTR 0.000 - 10.0 mm/min
@Thickness 3.05 mm
0.000 - 0.394 in/min
@Thickness 0.120 in
UL PLC 0 (0-10 mm/min)
 
Thermal PropertiesMetricEnglishComments
CTE, linear 38.0 µm/m-°C
@Temperature 20.0 °C
21.1 µin/in-°F
@Temperature 68.0 °F
ASTM D696
Maximum Service Temperature, Air 150 °C302 °FUL RTI
Deflection Temperature at 1.8 MPa (264 psi) 270 °C518 °FASTM D648
UL RTI, Electrical 150 °C302 °F
UL RTI, Mechanical with Impact 150 °C302 °F
UL RTI, Mechanical without Impact 150 °C302 °F
 
Processing PropertiesMetricEnglishComments
Mold Temperature 155 - 180 °C311 - 356 °F

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