Parker Chomerics THERMFLOW T725 Non-Silicone, Phase-Change Thermal Interface Pad

Parker Chomerics THERMFLOW T725 Non-Silicone, Phase-Change Thermal Interface Pad 物性表: Parker Chomerics THERMFLOW T725 Non-Silicone, Phase-Change Thermal Interface Pad物性表及特性介绍,Parker Chomerics THERMFLOW T725 Non-Silicone, Phase-Change Thermal Interface Pad注塑参数详情,如需Parker Chomerics THERMFLOW T725 Non-Silicone, Phase-Change Thermal Interface Pad下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.11 g/cc1.11 g/ccASTM D792
Thickness 127 microns5.00 mil
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+14 ohm-cm1.00e+14 ohm-cmASTM D257
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F@ 50 psi; ASTM D5470
 0.254 W/m-K
@Pressure 0.0690 MPa
1.76 BTU-in/hr-ft²-°F
@Pressure 10.0 psi
ASTM D5470
 0.463 W/m-K
@Pressure 0.172 MPa
3.21 BTU-in/hr-ft²-°F
@Pressure 24.9 psi
ASTM D5470
 0.693 W/m-K
@Pressure 0.345 MPa
4.81 BTU-in/hr-ft²-°F
@Pressure 50.0 psi
ASTM D5470
Melting Point 58.0 °C136 °FASTM D3418
Maximum Service Temperature, Air 125 °C257 °F
Minimum Service Temperature, Air -55.0 °C-67.0 °F
Flammability, UL94 V-0V-0
 
Processing PropertiesMetricEnglishComments
Shelf Life 12.0 Month12.0 MonthFrom date of shipment; Chomerics
 
Descriptive Properties
CarrierNone
ColorPink
Phase Transition Temperature55°CASTM D3418
Weight Loss<0.5%125°C for 48 Hours

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