Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive

Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive 物性表: Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive物性表及特性介绍,Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive注塑参数详情,如需Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive下载, 可到相关下载区下载
  • 密度 [g/cm3]: 1.07
  • 弯曲强度 [MPa]: 3.1
 
Physical PropertiesMetricEnglishComments
Density 1.07 - 1.70 g/cc0.0387 - 0.0614 lb/in³B Component; ASTM D1475
 2.08 - 2.18 g/cc0.0751 - 0.0788 lb/in³A Component; ASTM D1475
Viscosity 2700 cP2700 cPB Component; ASTM D1824
 150000 cP150000 cPA Component; ASTM D1824
Outgassing - Total Mass Loss 0.27 %0.27 %Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.0050 %0.0050 %Cured property; at 10E-6 torr; ASTM E595
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 8080Cured property; ASTM D2240
Tensile Strength, Ultimate 3.10 MPa450 psiCured property; ASTM D638
Elongation at Break 90 %90 %Cured property; ASTM D638
Adhesive Bond Strength 1.79 MPa260 psiAl-to-Al Lap Shear; Cured property; ASTM D1002
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.00e+14 ohm-cm2.00e+14 ohm-cmCured property; ASTM D257
Dielectric Constant 5.4
@Frequency 1000 Hz
5.4
@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength 24.4 kV/mm
@Thickness 1.27 mm
620 kV/in
@Thickness 0.0500 in
Cured; ASTM D149
Dissipation Factor 0.016
@Frequency 1000 Hz
0.016
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear  31.0 µm/m-°C
@Temperature 20.0 °C
17.2 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1
 137 µm/m-°C
@Temperature 20.0 °C
76.1 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2
Thermal Conductivity 0.744 W/m-K5.16 BTU-in/hr-ft²-°FCured property; COLORA
Glass Transition Temp, Tg -60.0 °C-76.0 °FCured property; JMTP P-200
Flash Point >= 150 °C>= 302 °FB Component; ASTM D92
 >= 200 °C>= 392 °FA Component; ASTM D92
 
Processing PropertiesMetricEnglishComments
Processing Temperature 85.0 °C185 °FCure 6 hrs
 100 °C212 °FCure 4 hrs
 125 °C257 °FCure 2 hrs

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