Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate

Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate 物性表: Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate物性表及特性介绍,Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate注塑参数详情,如需Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate下载, 可到相关下载区下载
  • 密度 [g/cm3]: 2.23
  • 吸水率 [%]: 0.02
  • 弯曲模量 [MPa]: 2.46
 
Physical PropertiesMetricEnglishComments
Density 2.23 g/cc0.0806 lb/in³ASTM D792 Method A
Water Absorption 0.020 %0.020 %IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss  0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
Water Vapor Recovered; NASA SP-R-0022A
 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
Collected Volatiles; NASA SP-R-0022A
 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
NASA SP-R-0022A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 45.5 MPa6600 psiCross; ASTM D882
 60.7 MPa8800 psiMachine; ASTM D882
Modulus of Elasticity 1.51 GPa219 ksiCross; ASTM D638
 1.90 GPa275 ksiMachine; ASTM D638
Flexural Modulus >= 2.46 GPa>= 357 ksiASTM D790
Compressive Modulus 1.63 GPa237 ksiASTM D695
Peel Strength 2.45 kN/m14.0 pliAfter Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.30e+14 ohm-cm2.30e+14 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 3.40e+12 ohm3.40e+12 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant  2.17 - 2.2
@Frequency 1.00e+6 Hz
2.17 - 2.2
@Frequency 1.00e+6 Hz
C23/50; IPC TM-650 2.5.5.3
 2.17 - 2.2
@Frequency 1.00e+10 Hz
2.17 - 2.2
@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 V>= 45000 VD48/50; ASTM D149
Dissipation Factor 0.00090
@Frequency 1.00e+10 Hz
0.00090
@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec>= 180 secD48/50; ASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear  28.0 µm/m-°C
@Temperature 0.000 - 100 °C
15.6 µin/in-°F
@Temperature 32.0 - 212 °F
y direction; IPC TM-650 2.4.24
 29.0 µm/m-°C
@Temperature 0.000 - 100 °C
16.1 µin/in-°F
@Temperature 32.0 - 212 °F
x direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 246 µm/m-°C
@Temperature 0.000 - 100 °C
137 µin/in-°F
@Temperature 32.0 - 212 °F
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.261 W/m-K
@Temperature 100 °C
1.81 BTU-in/hr-ft²-°F
@Temperature 212 °F
ASTM E1225
Flammability, UL94 V-0V-0Vertical Burn
 
Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)-151IPC TM-650 2.5.5.5 (-10 - 140°C)

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