Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate

Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate 物性表: Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate物性表及特性介绍,Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate注塑参数详情,如需Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate下载, 可到相关下载区下载
  • 密度 [g/cm3]: 2.26
  • 吸水率 [%]: 0.02
  • 弯曲模量 [MPa]: 2.56
 
Physical PropertiesMetricEnglishComments
Density 2.26 g/cc0.0816 lb/in³ASTM D792 Method A
Water Absorption 0.020 %0.020 %IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss  0.00 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.00 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
Water Vapor Recovered; NASA SP-R-0022A
 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
Collected Volatiles; NASA SP-R-0022A
 0.010 %
@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.010 %
@Pressure <=1.93e-8 psi,
Temperature 257 °F
NASA SP-R-0022A
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 67.6 MPa9800 psiCross; ASTM D882
 71.0 MPa10300 psiMachine; ASTM D882
Modulus of Elasticity 2.85 GPa414 ksiCross; ASTM D638
 3.52 GPa510 ksiMachine; ASTM D638
Flexural Modulus >= 2.56 GPa>= 371 ksiASTM D790
Compressive Modulus 1.90 GPa276 ksiASTM D695
Peel Strength 2.45 kN/m14.0 pliAfter Thermal Stress; IPC TM-650 2.4.8
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 8.00e+14 ohm-cm8.00e+14 ohm-cmC96/35/90; IPC TM-650 2.5.17.1
Surface Resistance 2.40e+12 ohm2.40e+12 ohmC96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant  2.33
@Frequency 1.00e+6 Hz
2.33
@Frequency 1.00e+6 Hz
C23/50; IPC TM-650 2.5.5.3
 2.33
@Frequency 1.00e+10 Hz
2.33
@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown >= 45000 V>= 45000 VD48/50; ASTM D149
Dissipation Factor 0.0013
@Frequency 1.00e+10 Hz
0.0013
@Frequency 1.00e+10 Hz
C23/50; IPC TM-650 2.5.5.5
Arc Resistance >= 180 sec>= 180 secD48/50; ASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear  23.0 µm/m-°C
@Temperature 0.000 - 100 °C
12.8 µin/in-°F
@Temperature 32.0 - 212 °F
x direction; IPC TM-650 2.4.24
 24.0 µm/m-°C
@Temperature 0.000 - 100 °C
13.3 µin/in-°F
@Temperature 32.0 - 212 °F
y direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 194 µm/m-°C
@Temperature 0.000 - 100 °C
108 µin/in-°F
@Temperature 32.0 - 212 °F
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.258 W/m-K
@Temperature 100 °C
1.79 BTU-in/hr-ft²-°F
@Temperature 212 °F
ASTM E1225
Flammability, UL94 V-0V-0Vertical Burn
 
Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)-171IPC TM-650 2.5.5.5 (-10 - 140°C)

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