LCP C230GI 材料说明:液晶聚合物树脂:sepaz LCP树脂具有传统塑料的一种独特的结构和性能没有想到的。在sepaz LCP以优异的综合性能和成型效率。sepaz LCP具有独特的属性,产品变得更薄,更大的机械强度。sepaz LCP连接器发现使用,传感器和其他电子元件和CD提取部分,在复印机和传真办公和视听设备部件。
LCP C230GI 性能表:
Physical Properties | Metric | English | Comments |
---|---|---|---|
Specific Gravity | 1.62 g/cc | 1.62 g/cc | ASTM D792 |
Linear Mold Shrinkage | 0.00 cm/cm | 0.00 in/in | |
Linear Mold Shrinkage, Transverse | 0.0090 cm/cm | 0.0090 in/in | |
Mechanical Properties | Metric | English | Comments |
Tensile Strength | 150.1 MPa | 21770 psi | ASTM D638 |
Elongation at Break | 1.7 % | 1.7 % | ASTM D638 |
Flexural Strength | 183.45 MPa | 26607 psi | ASTM D790 |
Flexural Modulus | 13.1 GPa | 1900 ksi | ASTM D790 |
Izod Impact, Notched | 2.16 J/cm | 4.04 ft-lb/in | ASTM D256 |
Electrical Properties | Metric | English | Comments |
Volume Resistivity | 1.00e+13 ohm-cm | 1.00e+13 ohm-cm | ASTM D257 |
Surface Resistance | 1.00e+15 ohm | 1.00e+15 ohm | ASTM D257 |
Dielectric Constant | 3.8 @Frequency 1.00e+6 Hz |
3.8 @Frequency 1.00e+6 Hz |
ASTM D150 |
Dielectric Strength | 24.0 kV/mm @Thickness 1.60 mm |
610 kV/in @Thickness 0.0630 in |
ASTM D149 |
Dissipation Factor | 0.029 @Frequency 1.00e+6 Hz |
0.029 @Frequency 1.00e+6 Hz |
ASTM D150 |
Thermal Properties | Metric | English | Comments |
CTE, linear | 14.0 µm/m-°C @Thickness 1.60 mm |
7.78 µin/in-°F @Thickness 0.0630 in |
ASTM D696 |
CTE, linear, Transverse to Flow | 36.0 µm/m-°C @Thickness 1.60 mm |
20.0 µin/in-°F @Thickness 0.0630 in |
ASTM D696 |
Melting Point | 352 °C | 666 °F | ASTM D789 |
Deflection Temperature at 1.8 MPa (264 psi) | 289 °C | 552 °F | ASTM D648 |
Flammability, UL94 | V-0 | V-0 |
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