Parker Chomerics CHO-FORM 5531 EMI Shielding Material

Parker Chomerics CHO-FORM 5531 EMI Shielding Material 物性表: Parker Chomerics CHO-FORM 5531 EMI Shielding Material物性表及特性介绍,Parker Chomerics CHO-FORM 5531 EMI Shielding Material注塑参数详情,如需Parker Chomerics CHO-FORM 5531 EMI Shielding Material下载, 可到相关下载区下载
 
Physical PropertiesMetricEnglishComments
Specific Gravity 3.20 g/cc3.20 g/ccASTM D792
Deformation 10 %10 %4 N/cm
 20 %20 %8 N/cm
 30 %30 %15 N/cm
 40 %40 %28 N/cm
 50 %50 %52 N/cm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 3535ASTM D2240
Tensile Strength at Break >= 0.517 MPa>= 75.0 psiASTM D412
Compression Set 40 %40 %ASTM D395 Method B 22 hrs 85°C
 40 %
@Temperature 85.0 °C,
Time 79200 sec
40 %
@Temperature 185 °F,
Time 22.0 hour
ASTM D395 Method B
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 0.0030 ohm-cm0.0030 ohm-cmInitial; Chomerics MAT-1002
 0.0040 ohm-cm0.0040 ohm-cmAged; Chomerics MAT-1002
Shielding Effectiveness  52 dB
@Frequency 1.00e+10 Hz
52 dB
@Frequency 1.00e+10 Hz
CHO-TP08
 55 dB
@Frequency 2.00e+9 Hz
55 dB
@Frequency 2.00e+9 Hz
CHO-TP08
 65 dB
@Frequency 6.00e+9 Hz
65 dB
@Frequency 6.00e+9 Hz
CHO-TP08
 67 dB
@Frequency 1.00e+9 Hz
67 dB
@Frequency 1.00e+9 Hz
CHO-TP08
 71 dB
@Frequency 2.00e+8 Hz
71 dB
@Frequency 2.00e+8 Hz
CHO-TP08
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 85.0 °C185 °F
 
Processing PropertiesMetricEnglishComments
Extrusion Rate 5.50 g/min5.50 g/min
Cure Time  18.0 min
@Temperature 22.0 °C
0.300 hour
@Temperature 71.6 °F
50% RH; Tack Free Time
 240 min
@Temperature 22.0 °C
4.00 hour
@Temperature 71.6 °F
50% RH; Handling Time
 2880 min
@Temperature 22.0 °C
48.0 hour
@Temperature 71.6 °F
50% RH; Full Cure
 
Descriptive Properties
Cure MechanismMoisture
FillerAg/Cu
ResinOne Part Silicone
Time for QC Measurements8 hrsElectrical Resistance and Adhesion @ 22°C 50% RH

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