Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive

Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive 物性表: Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive物性表及特性介绍,Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive注塑参数详情,如需Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive下载, 可到相关下载区下载
  • 弯曲模量 [MPa]: 6.29
 
Mechanical PropertiesMetricEnglishComments
Flexural Strength 46.2 MPa6700 psi5 lb Core, 6 hrs @ 220°F, Vacuum Bag
 49.0 MPa7100 psi8 lb Core, 6 hrs @ 220°F, Vacuum Bag
Flexural Modulus 6.29 GPa913 ksi5 lb Core, 6 hrs @ 220°F, Vacuum Bag
 6.76 GPa980 ksi8 lb Core, 6 hrs @ 220°F, Vacuum Bag
Shear Strength  15.13 MPa
@Temperature 82.2 °C
2195 psi
@Temperature 180 °F
Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 94; ASTM D1002
 17.13 MPa
@Temperature 82.2 °C
2485 psi
@Temperature 180 °F
Cure Cycle, 4 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 132; ASTM D1002
 17.33 MPa
@Temperature 82.2 °C
2513 psi
@Temperature 180 °F
Cure Cycle, 8 hrs @ 180°F, FPL Acid Etched 6061-T6, Std Dev 158; ASTM D1002
 19.68 MPa
@Temperature 60.0 °C
2855 psi
@Temperature 140 °F
Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 64; ASTM D1002
 21.59 MPa
@Temperature 60.0 °C
3131 psi
@Temperature 140 °F
Cure Cycle, 4 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 72; ASTM D1002
 22.39 MPa
@Temperature 60.0 °C
3248 psi
@Temperature 140 °F
Cure Cycle, 8 hrs @ 180°F, FPL Acid Etched 6061-T6, Std Dev 144; ASTM D1002
 22.45 MPa
@Temperature 21.1 °C
3256 psi
@Temperature 70.0 °F
Cure Cycle, 8 hrs @ 180°F, FPL Acid Etched 6061-T6, Std Dev 502; ASTM D1002
 22.5 MPa
@Temperature 21.1 °C
3270 psi
@Temperature 70.0 °F
Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 470; ASTM D1002
 23.30 MPa
@Temperature 60.0 °C
3379 psi
@Temperature 140 °F
Cure Cycle, 6 hrs @ 200°F, FPL Acid Etched 6061-T6, Std Dev 100; ASTM D1002
 24.1 MPa
@Temperature 82.2 °C
3490 psi
@Temperature 180 °F
Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 121; ASTM D1002
 24.1 MPa
@Temperature 82.2 °C
3500 psi
@Temperature 180 °F
2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched
 24.29 MPa
@Temperature 21.1 °C
3523 psi
@Temperature 70.0 °F
Cure Cycle, 1 hr @ 250°F, FPL Acid Etched 6061-T6, Std Dev 456; ASTM D1002
 24.51 MPa
@Temperature 82.2 °C
3555 psi
@Temperature 180 °F
Cure Cycle, 6 hrs @ 200°F, FPL Acid Etched 6061-T6, Std Dev 150; ASTM D1002
 27.10 MPa
@Temperature 71.1 °C
3931 psi
@Temperature 160 °F
Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 138; ASTM D1002
 27.6 MPa
@Temperature 21.1 °C
4010 psi
@Temperature 70.0 °F
Cure Cycle, 6 hrs @ 200°F, FPL Acid Etched 6061-T6, Std Dev 109; ASTM D1002
 27.9 MPa
@Temperature 60.0 °C
4040 psi
@Temperature 140 °F
Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 117; ASTM D1002
 27.97 MPa
@Temperature 21.1 °C
4056 psi
@Temperature 70.0 °F
Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 218; ASTM D1002
 28.14 MPa
@Temperature 21.1 °C
4082 psi
@Temperature 70.0 °F
Cure Cycle, 4 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 128; ASTM D1002
 30.74 MPa
@Temperature 21.1 °C
4459 psi
@Temperature 70.0 °F
Cure Cycle, 6 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 134; ASTM D1002
 32.30 MPa
@Temperature 21.1 °C
4685 psi
@Temperature 70.0 °F
Cure Cycle, 1 hr @ 250°F, FPL Acid Etched 6061-T6, Std Dev 9; ASTM D1002
 32.55 MPa
@Temperature 21.1 °C
4721 psi
@Temperature 70.0 °F
Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 128; ASTM D1002
 32.73 MPa
@Temperature 21.1 °C
4747 psi
@Temperature 70.0 °F
Cure Cycle, 90 min @ 250°F, FPL Acid Etched 6061-T6, Std Dev 84; ASTM D1002
 34.5 MPa
@Temperature 21.1 °C
5000 psi
@Temperature 70.0 °F
2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched
 35.32 MPa
@Temperature 21.1 °C
5123 psi
@Temperature 70.0 °F
Cure Cycle, 90 min @ 250°F, FPL Acid Etched 6061-T6, Std Dev 96; ASTM D1002
Peel Strength 5.33 kN/m30.4 pliT-Peel, Cure Cycle, 1 hr @ 250°F, FPL Acid Etched 6061-T6, Std Dev 1.6; ASTM D1876
 5.40 kN/m30.8 pliT-Peel, Cure Cycle, 6 hrs @ 220°F, FPL Acid Etched 6061-T6, Std Dev 1.9; ASTM D1876
 6.28 kN/m35.8 pliT-Peel, Cure Cycle, 90 min @ 250°F, FPL Acid Etched 6061-T6, Std Dev 2.3; ASTM D1876
 6.82 kN/m38.9 pliT-Peel, Cure Cycle, 90 min @ 250°F, FPL Acid Etched 6061-T6, Std Dev 3.1; ASTM D1876
 7.10 kN/m40.5 pliT-Peel, Cure Cycle, 2 hrs @ 250°F, FPL Acid Etched 6061-T6, Std Dev 3.4; ASTM D1876
 3.51 kN/m
@Temperature 82.2 °C
20.0 pli
@Temperature 180 °F
T-Peel, 2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched
 7.19 kN/m
@Temperature 21.1 °C
41.0 pli
@Temperature 70.0 °F
T-Peel, 2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched
 
Descriptive Properties
Drum Peel19.8 in-lb/inTool Side Up, 2 hrs @ 250°F, 30 psi, 6061 T6 Abraded, 1” Nomex 3 lb core 1/8” cell
 20.5 in-lb/inTool Side Down, 2 hrs @ 250°F, 30 psi, 6061 T6 Abraded, 1” Nomex 3 lb core 1/8” cell
Load to Failure606 lbf5 lb Core, 6 hrs @ 220°F, Vacuum Bag
 669 lbf8 lb Core, 6 hrs @ 220°F, Vacuum Bag

转载请注明: 转自中国塑胶原料之家 http://www.su-jiao.com/wuxingbiao/

本文链接: http://www.su-jiao.com/yuanliaoku/show-37710.html

免责声明: 本文 Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive 仅代表作者个人观点,中国塑胶原料之家无关。中国塑胶原料之家网所转载的内容,其版权均由原作者和资料提供方所拥有!如因作品版权问题需要处理,请与我们联络

塑胶原料之家,专业塑料网站、原料报价网站,免费发布塑胶供求信息。塑胶原料之家为您提供塑料供应、塑料求购、塑料行情、塑料展会、塑料原料资讯服务。

2008-2015 塑料|塑胶原料|物性表大全|UL黄卡|SGS报告查询|最新价格--塑胶原料之家

沪ICP备15027283号-4